Samsung has announced that it is now mass producing the industry’s first ePoP (embedded package on package) memory – a single memory package consisting of 3GB LPDDR3* DRAM, 32GB eMMC (embedded multi-media card) and a controller. For use in high-end smartphones, the extremely thin ePoP combines all essential memory components into a single package that can be stacked directly on top of the mobile processor, without taking any additional space – a distinct improvement over existing two-package eMCP memory solutions.
“By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features,†Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics.
“We plan to expand our line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market.â€Â
The new ePoP provides an ideal “one-package†memory solution, satisfying the market needs for high speed, high energy efficiency and compactness. The 3GB LPDDR3 mobile DRAM inside the ePoP operates at an I/O data transfer rate of 1,866Mb/s, and sports a 64-bit I/O bandwidth.
OEMs can use Samsung’s ePoP memory for a wide range of mobile devices. Samsung already has been offering a similar single-package solution for wearable devices, referred to as “wearable memoryâ€Â. The new configuration for phones can be easily customized not only for use in flagship smartphones but also in other sophisticated mobile devices such as high-end tablets, in collaboration with global mobile companies.
